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锡膏使用指南AGuidetotheOperationofSolderPastes 一、锡膏的储存I.Storingsolderpastes A.锡膏应保存在5-10℃环境下，保质期为六个月（从生产日算起）
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锡膏使用指南
A Guide to the Operation of Solder Pastes |
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| | | 一、锡膏的储存
I. Storing solder pastes |
| | A.锡膏应保存在5-10℃环境下，保质期为六个月（从生产日算起）。
B.在使用前，预先将锡膏从冰箱中取出室温下至少4小时，这是为了使锡膏恢复至工作温度，也是为防止水份在锡膏表面冷凝。
A. The solder pastes should be kept under the temperature of 5-10℃ at the shelf life of 6 months (calculated from the date of manufacture).
B. Before operation, first take the solder pastes out of refrigerators and let them stay at a room temperature for at least 4 hours to enable the solder pastes to recover to the operating temperature and also to prevent moisture from surface condensation on solder pastes. | | | |
| | | 二、 锡膏搅拌
II. Solder paste mixing |
| | A.为了使锡膏地混合均匀，在回温后请充分搅拌锡膏。
B．机器搅拌一般为1~3分钟，人工搅拌一般为3~6分钟（锡膏储存的时间越长，则搅拌时间越长）。
order for solder pastes to be completely mixed in a well distributed manner, after the return of temperature, please adequately mix the solder pastes.
B. The mechanical mixing usually last 1 to 3 minutes, while manual mixing usually lasts 3 to 6 minutes (The longer time the solder pastes are kept, the longer time the mixing requires). | | | |
| | | 三、使用环境
III. Operating Environment |
| | 锡膏的使用环境：温度为20~25℃，湿度为35~60%。
Optimal operating environment of solder pastes: temperature at 20~25℃, and humidity 35~60%。 | | | |
| | 印刷时锡膏使用注意事项：
A、将锡膏约1/3的量添加于钢网上，并以少量多次的添加方式补足钢网上的锡膏量、以维持锡膏的品质。
B、当天未使用完的锡膏，不可与尚未使用的锡膏共同放置，应另外存放在别的容器中。锡膏开封后在室温下建议于24小时内用完。
C、当天未用完的锡膏，隔天使用时建议将未用完的锡膏与新锡膏以1：2的比例搅拌混合使用，并以少量多次的方式添加使用。
D、锡膏印刷在基板上后，建议于4～6小时内放置元件进入回焊炉。
E、换线超过一小时以上，请于换线前将锡膏从钢网上刮起收入锡膏罐内封盖。
F、尽可能不要接触到皮肤，如接触时请用异丙醇清洗，并且避免吸入挥发之气体。
Cautions in the operation of solder pastes during printing:
A、 Add 1/3 solder pastes on a steel screen by supplementing enough solder pastes in a manner of a small amount in several times to maintain the quality of solder pastes.
B、 For the solder pastes that have not run out, do not place them together with those unused solder pastes. They should be put in other containers. After being unsealed, the solder pastes should be completely used under a room temperature within 24 hours.
C、 For the solder pastes that have not run out the same day, it is recommended that the unused solder pastes on the other day will be mixed with new solder pastes in the ratio of 1:2 for mixing and using, and they will be used in a manner of adding in a small amount in several times.
D、 After solder pastes are printed on substrates, it is recommended that components should be placed into the return solder pots within 4 to 6 hours.
E、 When wire exchange exceeds one hour or more, please scrape the solder pastes up from the steel screen and put it into the solder paste container for sealing.
F、 Try not to make it contact skin. In the case of any such contact, please use isopropanol for rinsing, and try to avoid inhalation of the volatile | | | |
| | 例： SnAgCu 无铅锡膏曲线
Example: Curve of SnAgCu Pb-free Solder Pastes
活化时间：Activating time
加热区：Heating zone
预热区：Preheating zone
时间：Time
回流区：Backflow zone
冷却区：Cooling zone
※其他各产品温度曲线请索阅各锡膏产品规格书。
※ For the curve of temperature of other products, please refer to the specifications of solder paste products. |
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